| Physical Properties |
EsthermTM |
| Density (g/cm3) |
1.32 |
| Color (Unfilled) |
Red/transparent |
| Thermal Properties |
EsthermTM |
| Short-term Thermal Stability (°C) |
425 (Inert) 350 (In Air) |
| Coefficient of Thermal Expansion (1/K) |
40 x 10-6 |
| Mechanical Properties |
ASTM Standard |
EsthermTM |
| Compressive Modulus (GPa) |
D695 |
4.07 |
| Compressive Strength (MPa) |
D695 |
303.8 |
| Tensile Strength (MPa) |
D695 |
95 |
| Young’s Modulus (GPa) |
D695 |
4.2 |
| Dielectric constant (4.8 µm) (25°, 10 khZ) |
|
5.0 |
| Dielectric breakdown strength (4.1 µm) (V/µm) |
|
384.4 |
| Limiting Oxygen Index |
|
40% |
For high performance applications, there are no polymeric that have high glass transition temperatures while also having excellent dimensional stability, ease of processibility due to solid state reactions as well as excellent mechanical properties. ATSP was created at the Department of Materials Science and Engineering at the University of Illinois, Urbana Champaign in Prof. Jim Economy’s group. Over two decades of academic research has led to fully understanding the structure-property relationships of this new class of materials. The polymer can be easily tailored to give the right blend of properties. If you have a high temperature application in mind, we can tailor the right Estherm grade for you.
We are looking for partners, collaborators and customers to bring this unique technology to the industrial markets. Interested in joining us in this new frontier of structural adhesives? Contact us or request a quote.